제조사 | ELAS |
---|---|
가격 | TBD |
문의 | 02-3461-1103 |
MASTER 1 laser micro machining workstation was originally developed for scribing of sapphire wafers. But many customisation options and optimized micromachining parameters such as pulse energy, pulse energy density, focusing conditions, etc. make it universal tool for many laser micro-processing applications.
Versatility in terms of materials
Taper controlled drilling
Only top – quality components
Intelligent laser machining software
Beam focus adjustment
Beam power (pulse energy) control
Scribing
Marking
Cutting
Drilling
Selective material ablation
Pattering, coating removal
Polymer
Glass
Sapphire
Metals
Ceramics
Synthetic diamond
Silicon
Laser type | DPSS, mode-locked, ps | Fiber, mode-locked, fs |
Average laser power | 6 W | 3 W |
Positioning type | Galvo scanner/ manual XYZ | |
Working field | 100 x 100 mm * | |
Positioning speed | 12 m/s | |
Power consumption (depends on laser power) | <1 – 4 kW, 240 VAC, 50-60 Hz | |
Laser safety | Class 1 (MPE) | |
Dimensions, mm (W x H x D) | 520 x 650 x 950 |
*other available on request
Automated Machine Vision
Dust and Fume Extraction
Samples mounting (vacuum chuck)
Internal vacuum generation station
Automated Z axis
Rotary axis
Power meter
Red laser beam pointer
Working field extension
Other options are available on request